Termin Detail

The 18th EuroSimE will take place from 2 to 5 April 2017 in Dresden. The topics of the conference encompass both the results of basic research and industrial applications in the fields of Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems. The event offers a mix of short courses, multiple specialist sessions as well as an exhibition. 



Local Organizer is Fraunhofer Institute for Ceramic Technologies and Systems IKTS, team of Dr.-Ing. Mike Röllig (Head of Department Testing of Electronics and Optical Methods) and Andrea Gaal (Press and Public Relations). 

EuroSimE addresses the results of both fundamental research and industrial application in the fields of thermal, mechanical and multiphysics simulation and experiments in microelectronics and microsystems. 

This includes, but is not limited to:

• Multi-physics simulation (e.g. thermal, mechanical, thermo-mechanical, coupled thermo-fluidic, coupled electro-mechanics, fluid structure interactions, opto-mechanics)
• Failure analysis and failure mode extraction
• Material characterisation, experiments and modelling
• Validation of simulations by experiments
• Failure criteria and damage modelling for reliability prediction
• Integrated process modelling
• Advanced numerical and analytical simulation methodologies and tools
• Behavioural modelling
• Simulation-based optimisation, virtual prototyping in product and/or process design
• Compact modelling and model order reduction
• Multiscale modeling and simulation

The applications cover all fields of (micro)-electronics and microsystems, but not limited to:

Components and packaging

• Flip-chip, BGA, CSP, Wafer-Level packages, MCM, Cu/low-k packages3-D packagingOpto-electronic packages
• High temperature and high power packaging
• Packaging for harsh environments

Microsystems

• Piezoelectric components
• MEMS sensors and actuators
• Opto-mechanical devices
• Nano-electronic mechanical devices
• Bio-MEMS/NEMS
• Microfluidics

LED lighting

Smart systems of 2nd and 3rd generation

Location:
The Westin Bellevue 
Grosse Meissner Strasse 15
01097 Dresden, Germany  
www.westin-dresden.de 

Find all information here: www.eurosime.org